ℹ️
Basic Information
SOC Name
HiSilicon Kirin 990 5G
Brand
hisilicon
Announcement Date
06 October 2019
Class
Flagship
Manufacturing Process
7nm
Manufacturing
TSMC
⚡
CPU Specifications
CPU Architecture
2x 2.86 GHz – Cortex-A76
2x 2.36 GHz – Cortex-A76
4x 1.95 GHz – Cortex-A55
CPU Cores
8 Core
CPU Frequency
2860MHz
Instruction Set
ARMv8.2-A
🧠
Cache & NPU
Cache
8 MB
SLC
2
NPU
Da Vinci Dual-core NPU
💾
Memory
Memory Type
LPDDR4X
Memory Frequency
2133MHz
Memory Bus
4
Max Bandwidth
34.1 Gb/s
Max Memory Size
12
🎮
GPU
GPU
Mali-G76 MP16
GPU Architecture
Bifrost 3rd gen
Pipelines
16 Pipeline
Shading Units
24 Unit
Total Shaders
384 Unit
Vulkan Version
Version 1.3
OpenCL Version
Version 2.0
💿
Storage & Display
Max Display Resolution
3360 x 1440
Max Camera Resolution
108
🎵
Video & Audio
Video Capture
4K @60FPS
Video Playback
4K @60FPS
Video Codecs
H.264, H.265, VC-1
Audio Codecs
AIFF, CAF, MP3, MP4, WAV
📶
Connectivity
5G Support
1
WiFi
Wifi 6
Bluetooth
Bluetooth 5.0
🛰️
Navigation Systems
GPS
Yes
GLONASS
Yes
Beidou
Yes
Galileo
No
QZSS
No
NAVIC
No
⚖️
Related SOC
Displayed SoCs are selected based on performance class suitability and key benchmark metrics.
MediaTek •
8 cores •
2023
720,423
HiSilicon Kirin 990 5G
hisilicon •
8 cores •
2019
714,339
Qualcomm •
8 cores •
2022
676,837
✅
Positive Aspects
1. Flagship CPU & Balanced Architecture
The Kirin 990 5G combines powerful Cortex-A76 cores in a split cluster architecture with efficiency Cortex-A55 cores, offering smooth overall system performance and good multi-threaded performance for 2019 flagship use cases. 2. Strong Graphics Performance
Equipped with a 16-core Mali-G76 GPU with Vulkan 1.3 and OpenCL 2.0 support, the chipset provides solid graphics capabilities suitable for gaming and multimedia playback at high resolutions. 3. Integrated 5G & Modern Connectivity
Kirin 990 5G integrates the Balong 5000 5G modem, offering extensive 5G capability alongside Wi-Fi 6 and Bluetooth 5.0 support, making it competitive among flagship devices of its time.
❌
Negative Aspects
1. Older Process Node
Built on a 7 nm+ process, Kirin 990 5G is less power efficient compared to newer 5 nm and 4 nm-class SoCs, which can result in higher power consumption under heavy workloads. 2. Mid-Tier AI Capability by Modern Standards
The integrated Da Vinci dual-core NPU, while advanced for its time, does not match the AI performance of later flagship NPUs from competitors, limiting its capabilities in AI-intensive tasks.